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Step 8：主板 功能 标识
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GPS IC：BROADCOM，BCM47531A1，Integrated Monolithic GPS、GLONASS、BeiDou and QZSS Receiver IC
WIFI & BT & FM IC ：BROADCOM，BCM4339XKUBG，TM1535 P10
Audio Amplifier：Maxim， MAX98925EWV，(2PCS)，a high-efficiency mono Class DG audio amplifier featuring an integrated boost converter and ADCs for sensing speaker current, speaker voltage,and battery supply voltage
ROM: SAMSUNG，546，KLMAG2GEND-B031，eMMC 5.0，16GB「平板外观：月光银」
Image Processor：ALTEK，6010-72M1，
SOC：HUAWEI ，Hisilicon 930，八核，4*2.0GHz 4*1.5GHz
RAM：SKhynix，H9CKNNNDATAT，DRNUH，550A，LPDDR3， 3GB
Power Management IC：Hisilicon，Hi6421
Charge Management IC：TI，BQ24196，2.5-A Single Cell USB / Adapter Charger with Narrow VDC Power Path Management and USB OTG
RF Transceivers：Hisilicon，Hi6361GFC，001TW1547,HP49A1547
Power Amplifier Module「功率放大器」：SKYWORKS，77814-11，Power Amplifier Module for LTE FDD Band 7 (2500–2570 MHz) and Band 30 「2305–2315 MHz」 and LTE TDD Bands 38/41 「2496–2690 MHz」, Band 40 「2300–2400 MHz」 and AXGP Band 「2545–2575 MHz」
Multimode Multiband Power Amplifier Module： TriQuint，TQP9059，multimode multiband Power Amplifier Module，WCDMA/HSDPA/HSUPA/HSPA / LTE QB GMSK EDGE B34, B39 TD-SCDMA, TD-LTE BC0, BC1 CDMA2000
